Event Detail
Title: Tutorial #4 - Design and Analysis of High-Performance Package and Die Power Delivery Networks
Type: Friday Tutorial
Track: Interconnect and Reliability
Day:
Friday
Time: 9:00 AM - 5:00 PM
Room: 6A
Organizers: E. Chiprout - Intel
Speakers: B. Krauter - IBM, F. Najm - U. Toronto, R. Panda - Freescale, E. Chiprout - Intel
Abstract: This tutorial will address multiple aspects of comprehending, analyzing and designing a high performance power delivery network from die to package. At the heart of any approach are the design requirements and constraints which will be outlined. Die and package electrical modeling, dynamic co-interaction and design optimization will be detailed. The effects of inductance, both at the package and die level will be discussed. The session will describe model reduction and simulation approaches and the problem of generating an excitation for the electrical model. Decoupling capacitance optimization will also be highlighted. An overview of the latest research and concepts in "vectorless" analysis methods will be given. The tutorial will give a comprehensive view of the design problem and outline what tradeoffs should be used for the design of robust power delivery networks.
